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How Optical 3D Measurement From Cairnhill Improves Quality Processes

How Optical 3D Measurement From Cairnhill Improves Quality Processes

Optical 3D measurement technology has become an indispensable tool in various industries, from chips and electronics to automotive and medical devices. One leading manufacturer is Bruker Alicona, which offers high-precision measurement solutions for a wide range of applications with help from Cairnhill.

The accuracy of the optical measuring devices from Bruker Alicona is achieved by using Advanced Focus-Variation technology. Based on this technology, the Bruker Alicona optical 3D measuring systems by Cairnhill Metrology close the gap between classical dimensional metrology and surface roughness measurement.

The core competence is the measurement of dimension, position, shape and roughness of complex components of different shapes, sizes and materials. Furthermore, measuring steep flanks with angles larger than 87° is not a problem at all, and even surfaces with strongly varying reflection properties and greatly varying roughness are measurable.

Advanced Focus-Variation also allows measuring samples with smooth and highly polished surfaces. Plus, users benefit from repeatable, robust and stable measurements, also in production. 

Where tactile methods fail, Bruker Alicona comes into the game with its optical 3D measurement technology. Users can measure both GD&T features and roughness parameters robustly, accurately, traceably and in high repeatability by using only one optical sensor. The product portfolio includes high-resolution optical measuring solutions for the shop floor and the laboratory.

Highest Precision For Electronic Components

In the field of chip and electronics manufacturing, the use of optical 3D measurement technology gained importance. The miniaturization of electronic components has made it difficult to measure and inspect their geometries with traditional measurement methods.

Bruker Alicona’s measurement solutions allow for the precise measurement of the dimension, position, shape and surface roughness of electronic components, such as PCBs, microchips, and MEMS devices.

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